FAN-OUT FOR CHIP, METHOD FOR FORMING FAN-OUT AND LIQUID CRYSTAL DEVICE USING FAN-OUT

摘要

A fan-out for a chip has at least two metal layers (M1, M2) which are respectively connected to different pins (111, 112) of the chip so as to transmit signals. The two metal layers (M1, M2) are separated by an insulated layer (152), and the projected positions of the two metal layers (M1, M2) are not overlapped near the pins (111, 112) of the chip and overlapped far away from the pins (111, 112) of the chip. Because the projected positions of the two metal layers (M1, M2) are not overlapped near the pins (111, 112) of the chip, the fan-out thickness of the chip is thinner at the positions of the pins (111, 112) of the chip, thus avoiding the problem of the thickness of the fan-out being too thick. Because the projected positions of the two metal layers (M1, M2) are overlapped far away from the pins (111, 112) of the chip, the distance between the conductive lines consisting of the metal layers is larger, thus it is easy in design and manufacturing. A method for forming the fan-out and a liquid crystal device using the fan-out are also disclosed.