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Solder Joint Reflow Process for Reducing Packaging Failure Rate
Solder Joint Reflow Process for Reducing Packaging Failure Rate
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机译:焊点回流工艺可降低包装失败率
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摘要
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.
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