首页> 外国专利> Sputtering Target Comprising Oxide Phase Dispersed in Co or Co Alloy Phase, Magnetic Thin Film Made of Co or Co Alloy Phase and Oxide Phase, and Magnetic Recording Medium Using the Said Thin Film

Sputtering Target Comprising Oxide Phase Dispersed in Co or Co Alloy Phase, Magnetic Thin Film Made of Co or Co Alloy Phase and Oxide Phase, and Magnetic Recording Medium Using the Said Thin Film

机译:包括分散在Co或Co合金相中的氧化物相,由Co或Co合金相和氧化物相制成的磁性薄膜以及使用该薄膜的磁记录介质的溅射靶

摘要

A sputtering target comprising an oxide phase is dispersed in Co or a Co alloy phase, wherein the sputtering target is configured from a metal matrix phase containing Co, and a phase containing SiO2 and having an oxide which forms particles and is dispersed in an amount of 6 to 14 mol % (hereinafter referred to as the “oxide phase”), the sputtering target contains, in addition to components configuring the metal matrix phase and the oxide phase, a Cr oxide scattered in or on a surface of the oxide phase in an amount of 0.3 mol % or more and less than 1.0 mol %, and an average area of the respective particles contained in the oxide phase is 2.0 μm2 or less. The provided sputtering target comprising an oxide phase is dispersed in Co or a Co alloy phase can reduce arcing, obtain a stable discharge in a magnetron sputtering device, and reduce the amount of particles that is generated during high density sputtering.
机译:包含氧化物相的溅射靶分散在Co或Co合金相中,其中该溅射靶由包含Co的金属基质相和包含SiO 2 并具有形成的氧化物的相构成。溅射靶以6〜14mol%的量分散(以下称为“氧化物相”),除了构成金属基体相和氧化物相的成分以外,还包含Cr氧化物,其分散在或形成在金属中。在氧化物相的表面上的量为0.3mol%以上且小于1.0mol%,并且氧化物相中包含的各个颗粒的平均面积为2.0μm 2 以下。所提供的包含氧化物相的溅射靶分散在Co或Co合金相中,可以减少电弧,在磁控溅射装置中获得稳定的放电,并且减少在高密度溅射期间产生的颗粒的量。

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