首页> 外国专利> Reduced Threshold Voltage-Width Dependency and Reduced Surface Topography in Transistors Comprising High-K Metal Gate Electrode Structures by a Late Carbon Incorporation

Reduced Threshold Voltage-Width Dependency and Reduced Surface Topography in Transistors Comprising High-K Metal Gate Electrode Structures by a Late Carbon Incorporation

机译:通过后期碳掺入降低了包含高K金属栅电极结构的晶体管的阈值电压-宽度依赖性和表面形貌

摘要

Performance and/or uniformity of sophisticated transistors may be enhanced by incorporating a carbon species in the active regions of the transistors prior to forming complex high-k metal gate electrode structures. On the other hand, increased yield losses observed in conventional strategies may be reduced by taking into consideration the increased etch rate of the carbon-doped silicon material in the active regions. To this end, the carbon species may be incorporated after the application of at least some aggressive wet chemical processes.
机译:在形成复杂的高k金属栅电极结构之前,可以通过在晶体管的有源区中掺入碳物质来增强复杂晶体管的性能和/或均匀性。另一方面,通过考虑有源区中碳掺杂硅材料的增加的蚀刻速率,可以减少常规策略中观察到的增加的产率损失。为此,可以在施加至少一些侵蚀性湿化学工艺之后掺入碳物质。

著录项

  • 公开/公告号US2012282744A1

    专利类型

  • 公开/公告日2012-11-08

    原文格式PDF

  • 申请/专利权人 PETER JAVORKA;STEPHAN KRONHOLZ;

    申请/专利号US201113101764

  • 发明设计人 PETER JAVORKA;STEPHAN KRONHOLZ;

    申请日2011-05-05

  • 分类号H01L21/8238;

  • 国家 US

  • 入库时间 2022-08-21 17:32:32

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