A modular development platform is described which enables creation of reliable, compact, physically robust and power efficient embedded device prototypes. The platform consists of a base module which holds a processor and one or more peripheral modules each having an interface element. The base module and the peripheral modules may be electrically and/or physically connected together. The base module communicates with peripheral modules using packets of data with an addressing portion which identifies the peripheral module that is the intended recipient of the data packet.
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