首页> 外国专利> MONOLITHIC FULL-COLOR LED MICRO-DISPLAY ON AN ACTIVE MATRIX PANEL MANUFACTURED USING FLIP-CHIP TECHNOLOGY

MONOLITHIC FULL-COLOR LED MICRO-DISPLAY ON AN ACTIVE MATRIX PANEL MANUFACTURED USING FLIP-CHIP TECHNOLOGY

机译:运用倒装芯片技术制造的有源矩阵面板上的全彩LED微显示

摘要

A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using PMOS process, NMOS process, or CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the PMOS/NMOS/CMOS process can be eliminated.
机译:使用倒装芯片技术制造了高分辨率,有源矩阵(AM)编程的单片发光二极管(LED)微阵列。制造过程包括制造LED微阵列和AM面板,并使用倒装芯片技术将所得的LED微阵列和AM面板组合在一起。 LED微阵列在蓝宝石衬底上生长并制造,并且AM面板可以使用PMOS工艺,NMOS工艺或CMOS工艺制造。同一行中的LED像素共享一条公共的N总线,该总线连接到AM面板的接地,而LED像素的p电极电隔离,从而每个p电极独立地连接到安装在其上的驱动电路的输出AM面板。 LED微阵列被倒装芯片结合到AM面板,使得AM面板单独地控制LED像素,并且LED像素表现出优异的发射均匀性。根据该构造,可以消除LED工艺与PMOS / NMOS / CMOS工艺之间的不兼容性。

著录项

  • 公开/公告号US2012223875A1

    专利类型

  • 公开/公告日2012-09-06

    原文格式PDF

  • 申请/专利权人 KEI MAY LAU;ZHAOJUN LIU;

    申请/专利号US201213466660

  • 发明设计人 KEI MAY LAU;ZHAOJUN LIU;

    申请日2012-05-08

  • 分类号G09G3/32;H01L33/52;H01L33/44;

  • 国家 US

  • 入库时间 2022-08-21 17:32:08

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