首页> 外国专利> METHOD FOR MANUFACTURING A MONOLITHIC LED MICRO-DISPLAY ON AN ACTIVE MATRIX PANEL USING FLIP-CHIP TECHNOLOGY AND DISPLAY APPARATUS HAVING THE MONOLITHIC LED MICRO-DISPLAY

METHOD FOR MANUFACTURING A MONOLITHIC LED MICRO-DISPLAY ON AN ACTIVE MATRIX PANEL USING FLIP-CHIP TECHNOLOGY AND DISPLAY APPARATUS HAVING THE MONOLITHIC LED MICRO-DISPLAY

机译:利用倒装芯片技术在有源矩阵板上制造单声道LED微显示器的方法和具有单声道LED微显示器的显示装置

摘要

A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the CMOS process can be eliminated.
机译:使用倒装芯片技术制造了高分辨率,有源矩阵(AM)编程的单片发光二极管(LED)微阵列。制造过程包括制造LED微阵列和AM面板,并使用倒装芯片技术将所得的LED微阵列和AM面板组合在一起。 LED微阵列在蓝宝石衬底上生长并制造,AM面板可使用CMOS工艺制造。同一行中的LED像素共享一条公共的N总线,该总线连接到AM面板的接地,而LED像素的p电极电隔离,从而每个p电极独立地连接到安装在其上的驱动电路的输出AM面板。 LED微阵列被倒装芯片结合到AM面板,使得AM面板单独地控制LED像素,并且LED像素表现出优异的发射均匀性。根据该构造,可以消除LED工艺和CMOS工艺之间的不兼容性。

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