首页> 外国专利> MANUFACTURING EXECUTION SYSTEM (MES) INCLUDING A WAFER SAMPLING ENGINE (WSE) FOR A SEMICONDUCTOR MANUFACTURING PROCESS

MANUFACTURING EXECUTION SYSTEM (MES) INCLUDING A WAFER SAMPLING ENGINE (WSE) FOR A SEMICONDUCTOR MANUFACTURING PROCESS

机译:制造执行系统(MES),包括用于半导体制造过程的晶圆采样引擎(WSE)

摘要

A method of sampling semiconductor wafers includes passing a lot of semiconductor wafers into a semiconductor processing tool, processing a first portion of the lot in one process chamber of the semiconductor processing tool and a second portion of the lot in another process chamber of the semiconductor processing tool to produce processed semiconductor wafers, and initiating a wafer sampling engine to select at least one of the processed semiconductor wafers for sampling. The wafer sampling engine computes a long term process capability index for the processing tool and a short term process performance index for at least one of the processing tool and process chamber, identifies at least one desired sampling measurement type, selects the at least one of the processed semiconductor wafers for sampling, and collects the desired measurement types from the at least one of the processed semiconductor wafers selected for sampling.
机译:一种对半导体晶片进行采样的方法,包括将许多半导体晶片传递到半导体处理工具中,在半导体处理工具的一个处理室中处理该晶片的第一部分,并在半导体处理的另一处理室中处理该晶片的第二部分。用于生产已加工的半导体晶片的工具,并启动晶片采样引擎以选择至少一个已加工的半导体晶片进行采样。晶片采样引擎为处理工具计算长期处理能力指数,为处理工具和处理腔室中的至少一个计算短期处理性能指数,识别至少一种所需的采样测量类型,选择以下至少一种:处理后的半导体晶片以进行采样,并从选择用于采样的至少一个处理后的半导体晶片中收集所需的测量类型。

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