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Integrated structures of high performance active devices and passive devices
Integrated structures of high performance active devices and passive devices
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机译:高性能有源器件和无源器件的集成结构
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摘要
Integrated structures having high performance CMOS active devices mounted on passive devices are provided. The structure includes an integrated passive device chip having a plurality of through wafer vias, mounted to a ground plane. The structure further includes at least one CMOS device mounted on the integrated passive device chip using flip chip technology and being grounded to the ground plane through the through wafer vias of the integrated passive device chip.
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