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Plasma processing apparatus including etching processing apparatus and ashing processing apparatus and plasma processing method using plasma processing apparatus
Plasma processing apparatus including etching processing apparatus and ashing processing apparatus and plasma processing method using plasma processing apparatus
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机译：包括蚀刻处理设备和灰化处理设备的等离子体处理设备以及使用该等离子体处理设备的等离子体处理方法
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摘要
A diameter of a mounting unit of the stage of an ashing processing apparatus is less than a diameter of a mounting unit of the stage of an etching processing apparatus, and the diameter of the mounting unit of the stage of the etching processing apparatus is less than a diameter of an objective item.
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