Sub-assembly for a light-emitting device package and a light emitting diode package with features preventing encapsulant delamination

摘要

A sub-assembly of a light-emitting device package and/or a light-emitting device package, the package comprising a cavity filled with an encapsulant, are disclosed with means preventing the encapsulant delamination. The means comprise an expansion volume within the light-emitting device package, together with means allowing the encapsulant to flow from the cavity into the expansion volume as the encapsulant expands, and to flow back into the cavity as the encapsulant contracts during heating and cooling of the light-emitting device package.