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Thin film lamination, thin film magnetic sensor using the thin film lamination and method for manufacturing the thin film lamination

机译:薄膜叠层,使用该薄膜叠层的薄膜磁传感器及其制造方法

摘要

Relating to a thin film lamination and a thin film magnetic sensor using the thin film lamination and a method for manufacturing the thin film lamination that realizes a thin film conducting layer having high electron mobility and sheet resistance as an InAsSb operating layer. A thin film lamination is provided which is characterized by having an AlxIn1−xSb mixed crystal layer formed on a substrate, and an InAsxSb1−x (0x≦1) thin film conducting layer directly formed on the AlxIn1−xSb layer, in which the AlxIn1−xSb mixed crystal layer is a layer that exhibits higher resistance than the InAsxSb1−x thin film conducting layer or exhibits insulation or p-type conductivity, and its band gap is greater than the InAsxSb1−x thin film conducting layer, and the a lattice mismatch is +1.3% to −0.8%.
机译:关于使用该薄膜叠层的薄膜叠层和薄膜磁传感器以及制造该薄膜叠层的方法,该方法实现了具有高电子迁移率和薄层电阻的薄膜导电层作为InAsSb操作层。提供了一种薄膜叠层,其特征在于在基板上形成有Al x In 1-x Sb混合晶体层,以及InAs x x In 1-x Sb层上形成的Sub> Sb 1-x (0 x In 1-x Sb混合晶体层是比InAs x Sb 具有更高电阻的层1-x 薄膜导电层或具有绝缘性或p型导电性,并且其带隙大于InAs x Sb 1-x 薄膜导电层,且晶格失配为+ 1.3%至-0.8%。

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