PULSE HIGH-PERFORMANCE MAGNETIC SPONGE PROCESS AND HIGH-PERFORMANCE ELECTRIC POWER SOURCE

摘要

The invention relates to a high-power pulsed magnetron sputtering process (1), wherein within a process chamber (2) by means of an electrical energy source (3) a sequence of complex discharge pulses (4) is produced by applying an electrical voltage (V) between an anode (5) and a cathode (6) in order to ionize a sputtering gas (7). Said complex discharge pulse (4) is applied for a complex pulse time (Ä). The cathode (6) has a target (8) comprising a material to be sputtered for the coating of a substrate (9), and said complex discharge pulse (4) includes an electrical high-power sputtering pulse (10) having a negative polarity with respect to the anode (5) and being applied for a first pulse-time (Ä 1 ), the high-power sputtering pulse (10) being followed by an electrical low-power charge cleaning pulse (11) having a positive polarity with respect to the anode (5) and being applied for a second pulse-time (Ä 2 ). According to the present invention, a ratio Ä 1 / Ä 2 of the first pulse-time (Ä 1 ) in proportion to the second pulse-time (Ä 2 ) is 0.5 at the most. The invention relates furthermore to a high-power electrical energy source (3) for producing a complex discharge pulse (4) for carrying out a process in accordance with the present invention.