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METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE
METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE
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机译:用LCP基板密封柔性电路的方法和装置
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摘要
A method and apparatus is disclosed for affixing a cover layer formed ofliquid crystal polymer to a flex circuit consisting of circuit elementsmounted to a liquid crystal polymer substrate in order to encapsulate thecircuit elements between the cover layer and substrate to protect them fromexposure to moisture and contaminants.
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