TREATMENT, BEFORE THE BONDING OF A MIXED COPPER OXIDE SURFACE, BY A PLASMA CONTAINING NITROGEN AND HYDROGEN

摘要

A method of bonding between a first surface (1) provided with at least one copper zone (3), surrounded by a silicon oxide zone (4) and a second surface (1') comprises an operation of treating the first surface (1) with a plasma before the first surface (1) is brought into contact with the second surface (V). The plasma is generated from a gas source containing an agent for nitriding the silicon oxide and an agent for reducing the copper oxide, based on hydrogen. The gas source may comprise an N₂/NH₃ and/or N₂/H₂ gas mixture or even an N₂O/H₂ gas mixture or else ammonia gas, which then acts both as nitriding agent and reducing agent. The plasma obtained from this gas source then necessarily comprises nitrogen and hydrogen, thereby making it possible, in a single operation, to provide a strong bond between the first and second surfaces (1, 1').