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TREATMENT, BEFORE THE BONDING OF A MIXED COPPER OXIDE SURFACE, BY A PLASMA CONTAINING NITROGEN AND HYDROGEN
TREATMENT, BEFORE THE BONDING OF A MIXED COPPER OXIDE SURFACE, BY A PLASMA CONTAINING NITROGEN AND HYDROGEN
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机译:结合氮和氢的等离子体处理混合的氧化铜表面之前
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摘要
A method for bonding a first surface provided with at least one copper area surrounded by a silicon oxide area to a second surface includes an operation of treatment of the first surface by a plasma, before placing the first surface in contact with the second surface. The plasma is formed from a gas source containing a silicon oxide nitriding agent and a copper oxide reducing agent containing hydrogen. The gas source may include an N2 and NH3 and/or H2 gas mixture or a N2O and H2 gas mixture, or ammonia, which is then used both as a nitriding agent and as a reducing agent. The plasma obtained from this gas source then necessarily contains nitrogen and hydrogen, which enables, in a single operation, to provide a high-performance bonding between the first and second surfaces.
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