TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE CHIP PACKAGE USING LAND GRID ARRAY JOINING

摘要

The present invention relates to a signal chip package. An apparatus for a single chip package using land grid array (LGA) joining includes: a multi-layer substrate in which at least one or more board layers are provided, and at least one first chip area and at least one second chip area are defined on the lowermost substrate layer, the multi-layer substrate constituting a transmission line transition having a vertical structure for transmitting a signal outputted from at least one integrated circuit (IC) chip jointed to the first chip area in a coaxial shape or co-planar waveguide guide (CPW) shape, and including a LGA joint pad connected to a printed circuit board (PCB) on the lowermost layer; at least one IC chip jointed to the first chip area and the second chip area; and the PCB LGA-jointed and connected to the multi circuit board through the LGA joint pad.