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METHOD FOR MEASURING THE ACTIVE KOH CONCENTRATION IN A KOH ETCHING PROCESS
METHOD FOR MEASURING THE ACTIVE KOH CONCENTRATION IN A KOH ETCHING PROCESS
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机译:在酸值蚀刻过程中测量活性酸值的方法
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摘要
The invention relates to a method for in-line measuring the active KOH concentration in a KOH etching process in which process silicon hydroxide is produced by a reduction reaction according to the formula: 2K+ (aq.) + 2OH- (aq.) + 2H2O + Si - 2K+ (aq.) + H2SiO42- (aq.) + 2H2 (g). The total concentration of KOH bath is measured by using a refractometer and the measurement result is corrected by the estimated K2H2SiO4 concentration.
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