首页> 外国专利> ALLOY OF TUNGSTEN (W) AND COPPER (CU) HAVING FUNCTIONALLY GRADED MATERIAL (FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU

ALLOY OF TUNGSTEN (W) AND COPPER (CU) HAVING FUNCTIONALLY GRADED MATERIAL (FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU

机译:功能梯度材料(WGM)的钨(W)和铜(CU)合金,钨和铜的合金具有相同的特征和制造方法

摘要

Disclosed are a tungsten-copper alloy, a metal material having the same and a fabrication method for the tungsten-copper alloy, the fabrication method including generating tungsten-copper composite powders such that tungsten is coated on copper powders and the composition ratios of copper and tungsten are different, sequentially laminating the tungsten-copper composite powders to create a plurality of layers, having sequentially increasing or decreasing contents of tungsten, and sintering the plurality of layers under conditions of temperature and time preset for generation of tungsten-copper alloy, whereby the tungsten-copper alloy and high thermal conductivity and fabrication reliability by virtue of precise morphologies can be created.
机译:公开了一种钨铜合金,具有该金属铜材料的金属材料以及该钨铜合金的制造方法,该制造方法包括产生钨铜复合粉末以将钨涂覆在铜粉末上以及铜和铜的组成比。钨是不同的,依次层叠钨-铜复合粉末以产生具有依次增加或减少的钨含量的多层,并在为产生钨-铜合金而预先设定的温度和时间条件下烧结多层,从而可以形成钨铜合金,并具有精确的形貌,具有很高的导热性和制造可靠性。

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