首页> 外国专利> Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminium, indium, gallium) nitride ((AI, In,Ga)N) substrates for opto-electronic and electronic devices

Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminium, indium, gallium) nitride ((AI, In,Ga)N) substrates for opto-electronic and electronic devices

机译:在光电和电子设备的自支撑(铝,铟,镓)氮化物((AI,In,Ga)N)衬底上实现改善的外延质量(表面纹理和缺陷密度)的方法

摘要

A homoepitaxial III-V nitride article, comprising a III-V nitride homoepitaxial layer deposited on a free-standing III-V nitride material substrate, wherein said III-V nitride homoepitaxial layer has a dislocation density of less than 1E6 dislocations per square centimeter, and the article comprises one of the following features: (i) oxidized material is provided between the III-V nitride homoepitaxial layer and the free-standing III-V nitride material substrate; (ii) an epi interlayer is provided between the III-V nitride homoepitaxial layer and the free-standing III-V nitride material substrate; and (iii) the free-standing III-V nitride material substrate is offcut, and the III-V nitride homoepitaxial layer comprises non-(0001) homoepitaxial step flow crystal growth.
机译:一种同质外延III-V族氮化物制品,包括沉积在独立的III-V族氮化物材料衬底上的III-V族氮化物同质外延层,其中所述III-V族氮化物同质外延层的位错密度小于每平方厘米1E6位错。所述物品包括以下特征之一:(i)在所述III-V族氮化物同质外延层与所述独立式III-V族氮化物材料基板之间设置有氧化材料。 (ii)在III-V族氮化物同质外延层与自支撑III-V族氮化物材料基板之间设置外延夹层。 (iii)将独立的III-V族氮化物材料衬底切掉,并且该III-V族氮化物同质外延层包括非(0001)同质外延阶梯流晶生长。

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