IC-Package with integrated impedance matching and harmonic suppression

摘要

A package connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit (72) to provide an impedance match for a signal to be sent to a circuit (74) external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs (2b1, 2b2) on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs (2b1, 2b2) have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.