ADVANCED FOCAL PLANE ARRAY CONCEPT FOR OVERHEAD PERSISTENT IR APPLICATIONS

摘要

A vertical-stack integrated sensor chip assembly (100) having a multiplicity of pixels (410) for detecting infrared radiation (450) comprises a micro-optics structure (110) for processing infrared radiation (450), a photovoltaic detector layer (120) for converting the infrared radiation into a signal, and two readout integrated circuit input cell layers. The sensor chip assembly (100) has spatial foveal vision, and synchronous and spatially co-registered dual-color capability. The vertical-stack sensor chip assembly (100) integration enables four-side butted modular assembly of sensor chip assemblies (100) with minimal gaps for the formation of large-area focal plane arrays (200) with synchronous and spatially co-registered dual-color, foveal vision, and curved focal image detection capabilities.