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Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
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机译:将半导体结构直接键合在一起的方法以及使用这种方法形成的键合半导体结构
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摘要
Embodiments of the present invention include methods of directly bonding together semiconductor structures. In some embodiments, a cap layer may be provided at an interface between directly bonded metal features of the semiconductor structures. In some embodiments, impurities are provided within the directly bonded metal features of the semiconductor structures. Bonded semiconductor structures are formed using such methods.
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