首页>
外国专利>
Copper nano paste, method for forming the copper nano paste, and method for forming electrode using the copper nano paste
Copper nano paste, method for forming the copper nano paste, and method for forming electrode using the copper nano paste
展开▼
机译:铜纳米糊,铜纳米糊的形成方法以及使用该铜纳米糊的电极的形成方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.
展开▼