COPPER NANO PASTE AND METHOD FOR FORMING THE COPPER NANO PASTE, AND METHOD FOR FORMING ELECTRODE USING THE COPPER NANO PASTE

摘要

The present invention relates to a relatively copper nano- paste is fired at a low temperature processable , embodiments of the present invention for copper nano- paste additive is added to the binder to be added in an amount of 0.1 to 30 parts by weight , 10 parts by weight or less in accordance with , and 1 to 95 weight parts be added , and has a particle size of 150nm or less , the surface is coated with a capping material comprises particles comprising copper .