WHITE LIGHT SCANNING TYPE WAFER THICKNESS MEASURING APPARATUS CAPABLE OF OPTIMIZING THE AMOUNT OF SCATTERING OR REFLECTED LIGHTS ACCORDING TO THE STATE OF A WAFER

摘要

PURPOSE: A white light scanning type wafer thickness measuring apparatus is provided to obtain an improved image by reducing an error caused by light refraction according to the position of a wafer.;CONSTITUTION: A white light scanning type wafer thickness measuring apparatus comprises a light source unit(20) which irradiates white light to a wafer, a camera(30) which receives the light reflected off the wafer, and a thickness calculation unit(50) which measures the thickness of the wafer by taking signals of specific wave lengths from image signals transmitted from the camera.;COPYRIGHT KIPO 2012