WAFER BACK-SIDE GRINDING APPARATUS HAVING FUNCTIONS OF WIRELESS SIGNAL TRANSMISSION AND/OR WIRELESS POWER DRIVING, CAPABLE OF PERFORMING A CHIP FAIL TEST EVEN AFTER POLISHING A WAFER

摘要

PURPOSE: A wafer back-side grinding apparatus having functions of wireless signal transmission and/or wireless power driving are provided to perform a fail test of a chip included in a wafer while transmitting a wireless signal to a tester wireless signal unit and arranging wafers.;CONSTITUTION: In a wafer back-side grinding apparatus having functions of wireless signal transmission and/or wireless power driving, the wafer(20) of a wafer cassette(402) is transferred to a transfer apparatus to a wafer test part(630). The wafer comprises an electricity receiver(30). The tester(410) comprises a power transmitter(200). A substrate wireless signal unit(40) includes a substrate signal transmission and reception unit, a substrate signal controller(46). A test signal circuit(114) converts signal in the test signal transmission and reception unit.;COPYRIGHT KIPO 2012