PATTERN FORMING METHOD AND A PATTERN STRUCTURE CAPABLE OF SIMPLIFYING FORMING PROCESSES WITHOUT AN ETCHING PROCESS BY FORMING PATTERNS AND SUBSEQUENTLY COATING A THIN FILM

摘要

PURPOSE: A pattern forming method and a pattern structure are provided to minimize the use of chemicals and to save a cost required for an etching facility by omitting an etching process.;CONSTITUTION: Patterns are formed on a substrate through a photo-resist. A thin film is coated on the substrate and the patterns. The patterns are delaminated from the thin film which is coated on the patterns. A method for forming the patterns includes the following: A photo-resist is formed on the substrate. The photo-resist is exposed through a mask(S130). The exposed photo-resist is developed to patterns(S150).;COPYRIGHT KIPO 2012