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WIRING CIRCUIT BOARD CAPABLE OF PREVENTING LIQUID PENETRATION AND RESIDUAL LIQUID ON A POROUS MATERIAL AND A MANUFACTURING METHOD THEREOF
WIRING CIRCUIT BOARD CAPABLE OF PREVENTING LIQUID PENETRATION AND RESIDUAL LIQUID ON A POROUS MATERIAL AND A MANUFACTURING METHOD THEREOF
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机译:能够防止多孔材料上的液体渗透和残留液体的配线电路板及其制造方法
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摘要
PURPOSE: A wiring circuit board and a manufacturing method thereof are provided to arrange consecutive holes with an average diameter of 1.0μm or less on polytetrafluoroethylene of an insulting layer, thereby preventing penetration of process liquid.;CONSTITUTION: A plurality of conductive patterns(2) is arranged on a porous base insulating layer(1) made of expanded polytetrafluoroethylene(ePTFE). Porous polytetrafluoroethylene(PTFE) which has consecutive holes is easily formed using the ePTFE. The conductive pattern is comprised of a wiring pattern or a ground pattern. The conductive pattern has a laminated structure which includes a seed layer(2a) made of a chrome and copper laminated film and a conductive layer(2b) made of copper. A cover insulating layer(3) is arranged on the base insulating layer in order to cover the conductive pattern.;COPYRIGHT KIPO 2012
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