APPARATUS FOR TREATING A SUBSTRATE AND A METHOD FOR TREATING THE SUBSTRATE CAPABLE OF SHORTENING TIMES REQUIRED FOR TREATMENT BY SIMULTANEOUSLY TREATING THE ENTIRE SUPPER AND LOWER SIDES OF THE SUBSTRATE

摘要

PURPOSE: An apparatus for treating a substrate and a method for treating the substrate are provided to supply treating liquid to the entire main side of the substrate and to reduce the using amount of the treating liquid.;CONSTITUTION: An apparatus for treating a substrate includes a substrate maintaining unit, a treating liquid supplying unit, and a hydrophilic side disposition unit. The substrate maintaining unit is in a non-contact state to the main side of a substrate while the substrate maintaining unit horizontally maintains the substrate. The treating liquid supplying unit supplies treating liquid to the main side of the substrate. Circular hydrophilic sides(29, 30) in contact with the liquid film of the treating liquid on the main side of the substrate are disposed along the main side circumference of the substrate.;COPYRIGHT KIPO 2012