'Apparatus and Method for Treating Substrate' in PatentApplication Approval Process

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'Apparatus and Method for Treating Substrate' in PatentApplication Approval Process

机译：专利申请批准程序中的“处理基材的设备和方法”

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2013 JAN 7 (VerticalNews) -- By a News Reporter-Staff News Editor at Robotics & Machine Learning -- A npatent application by the inventors Kim, Hyung Joon (Gyeonggi-do, KR), filed on May 31, 2012, was ncleared for further review on December 27, 2012, according to news reporting originating from nWashington, D.C., by VerticalNews correspondents.

机译：2013年1月7日（VerticalNews）-由机器人与机器学习新闻记者-工作人员新闻编辑-2012年5月31日提交的发明人Kim Hyung Joon（韩国京畿道）的专利申请被清除根据垂直新闻通讯社源自华盛顿特区的新闻报道，将于2012年12月27日进行进一步审核。

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《Robotics and Machine Learning》 |2013年第1期|1-5|共5页
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Patents, Robotics, Electronics, Transferrin, Semiconductor,;

机译：专利;机器人;电子;转铁蛋白;半导体;

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'Apparatus and Method for Treating Substrate' in PatentApplication Approval Process

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