SEMICONDUCTOR PACKAGE AND A MANUFACTURING METHOD THEREOF CAPABLE OF IMPROVING INTEGRATION USING LTCC TECHNOLOGY

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to comprise the semiconductor package without a wire bonding by mounting a plurality of semiconductor chips using LTCC(Low Temperature Cofired Ceramic) technology.;CONSTITUTION: A package body(100) includes a plurality of sheets(101-109). An external connection terminal(300) is formed on a first surface of the package body. Conductive patterns and vias(131-138) comprise a passive device in the package body. A plurality of semiconductor chips(201-205) are mounted in the package body. The semiconductor chips are electrically connected to the conductive patterns by a bump(180).;COPYRIGHT KIPO 2012