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ULTRATHIN WAFER MICRO-MACHINING METHOD AND SYSTEM BY LASER RAIL-ROADING TECHNIQUE
ULTRATHIN WAFER MICRO-MACHINING METHOD AND SYSTEM BY LASER RAIL-ROADING TECHNIQUE
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机译:激光滚动技术的超薄晶圆微加工方法及系统
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摘要
PURPOSE: a kind of method and apparatus, for critically processed wafer by laser railroading process to improve productivity and quality, by controlling the polarization laser of laser into right angle orientation. ;CONSTITUTION: a kind of light irradiation device (110) irradiation object (500) and multiple lasers. The upper lateral section (120) of object load. A kind of mobile light illuminating unit of movement army (130) and stage. Nozzle (140) removes surface of the foreign matter from the object, and eliminates by-product. ;The 2012 of copyright KIPO submissions
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