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ULTRATHIN WAFER MICRO-MACHINING METHOD AND SYSTEM BY LASER RAIL-ROADING TECHNIQUE

机译:激光滚动技术的超薄晶圆微加工方法及系统

摘要

PURPOSE: a kind of method and apparatus, for critically processed wafer by laser railroading process to improve productivity and quality, by controlling the polarization laser of laser into right angle orientation. ;CONSTITUTION: a kind of light irradiation device (110) irradiation object (500) and multiple lasers. The upper lateral section (120) of object load. A kind of mobile light illuminating unit of movement army (130) and stage. Nozzle (140) removes surface of the foreign matter from the object, and eliminates by-product. ;The 2012 of copyright KIPO submissions
机译:用途:一种方法和设备,通过将激光的偏振激光控制为直角取向,通过激光铁路工艺对晶片进行严格处理,以提高生产率和质量。 ;组成:一种光照射装置(110)照射物体(500)和多个激光器。物体负载的上部侧面(120)。一种运动军队(130)和舞台的移动照明装置。喷嘴(140)从物体上清除异物表面,并消除副产物。 ; 2012年版权KIPO提交文件

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