LEAD FRAME SUBSTRATE FOR AN LED PACKAGE AND A MANUFACTURING METHOD THEREROF CAPABLE OF REDUCING MANUFACTURING COSTS

摘要

PURPOSE: A lead frame substrate for an LED package and a manufacturing method thereof are provided to reduce costs required for products production by omitting a process which molds material functioning as a partition wall and an isolation support.;CONSTITUTION: An insulating layer is formed inside via hole. A register film formed on one side of a metallic board is exposed and developed. The register film is deeply half-etched than height of the insulating layer. A plating layer(108) is formed on the surface of the metallic board except for the upper side of the insulating layer. An LED chip is mounted on the top of the plated metallic board. The LED chip and a circuit pattern are bonded by a wire. The upper side of the LED chip and the circuit pattern is molded by a fluorescent substance and a resin.;COPYRIGHT KIPO 2012