首页> 外国专利> POSITIVE PHOTO-RESIST COMPOSITION CAPABLE OF IMPROVING THERMAL STABILITY, SENSITIVITY, AND PATTERN DEVELOPMENT CHARACTERISTIC

POSITIVE PHOTO-RESIST COMPOSITION CAPABLE OF IMPROVING THERMAL STABILITY, SENSITIVITY, AND PATTERN DEVELOPMENT CHARACTERISTIC

机译:能够提高热稳定性,灵敏度和图案开发特性的正性光致抗蚀剂组合物

摘要

PURPOSE: A positive photo-resist composition is provided to improve sensitivity and to reduce failure rate by stably securing thermal distribution.;CONSTITUTION: A positive photo-resist composition includes a first alkali soluble resin represented by chemical formula 1, a second alkali soluble resin, a dissolution inhibitor, and a solvent. The polystyrene-reduced weight average molecular weight of the first alkali soluble resin is between 1,000 and 5,000. In chemical formula 1, R9 to R14 are respectively hydrogen atoms, C1 to C6 linear or branched alkyl groups, C1 to C6 linear or branched alkoxy groups, or C3 to C6 cycloalkyl groups; R16 to R18 are respectively selected from a group including hydrogen atoms, C1 to C6 linear or branched alkyl groups, and C6 to C18 aryl groups; N is 10 to 200.;COPYRIGHT KIPO 2012
机译:目的:提供一种正型光刻胶组合物,以通过稳定地确保热分布来提高灵敏度并降低失效率。;组成:正型光刻胶组合物包含化学式1表示的第一碱可溶性树脂,第二碱可溶性树脂,溶解抑制剂和溶剂。第一碱溶性树脂的聚苯乙烯换算的重均分子量为1,000至5,000。在化学式1中,R 9至R 14分别为氢原子,C 1至C 6直链或支链的烷基,C 1至C 6直链或支链的烷氧基或C 3至C 6的环烷基; R16至R18分别选自氢原子,C1至C6直链或支链烷基和C6至C18芳基。 N为10到200。; COPYRIGHT KIPO 2012

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号