首页> 外国专利> SCRIBER CUTTER WHEEL AND A METHOD FOR MANUFACTURING THE SAME OVERCOMING A FLEXIBLE PROPERTY BEING DISPLAYED WHEN ONLY USING A DIAMOND

SCRIBER CUTTER WHEEL AND A METHOD FOR MANUFACTURING THE SAME OVERCOMING A FLEXIBLE PROPERTY BEING DISPLAYED WHEN ONLY USING A DIAMOND

机译:仅使用钻石时,会显示出划痕刀轮及其制造方法以克服柔性资产的问题

摘要

PURPOSE: A scriber cutter wheel and a method for manufacturing the same are provided to improve a property of a flexible CVD(Chemical Vapor Deposition) diamond because a ceramic and puberty materials are firmly adhered to both sides of a CVD diamond.;CONSTITUTION: A scriber cutter wheel comprises a disk, a first substrate(12), a circular CVD diamond layer(20), a circular second substrate(14), and a welding alloy. The circular first substrate comprises puberty materials and a ceramic. The circular CVD diamond layer is comprised in one side surface of the substrate. The circular second substrate is comprised in the other side surface of the substrate. The circular second substrate comprises the puberty materials and the ceramic. The fist substrate is a sintered body including one or more among WC-Co, siC, Si 3N 4, AlN(Aluminum-Nitride), and c- BN(Cubic Boronitride). The welding alloy is comprised in between the CVD diamond layer and second substrate.;COPYRIGHT KIPO 2012
机译:目的:提供一种划刻刀轮及其制造方法,以提高柔性CVD(化学气相沉积)金刚石的性能,因为陶瓷和青春期材料牢固地粘附在CVD金刚石的两面。划刻刀轮包括盘,第一基底(12),圆形CVD金刚石层(20),圆形第二基底(14)和焊接合金。圆形的第一基底包括青春期材料和陶瓷。圆形CVD金刚石层包含在基板的一个侧面中。圆形的第二基板被包括在基板的另一侧表面中。圆形的第二基底包括青春期材料和陶瓷。第一衬底是包括WC-Co,SiC,Si 3N 4,AlN(氮化铝)和c-BN(立方氮化硼)中的一种或多种的烧结体。焊接合金包含在CVD金刚石层和第二基材之间。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120076024A

    专利类型

  • 公开/公告日2012-07-09

    原文格式PDF

  • 申请/专利权人 PRECISION DIAMOND CO. LTD.;

    申请/专利号KR20100137986

  • 发明设计人 CHAE KI WOONG;

    申请日2010-12-29

  • 分类号B23B27/14;B23D61/00;C23C16/27;B22F3/12;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:37

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