HEAT CONDUCTION FOR CHIP STACKS AND 3-D CIRCUITS CAPABLE OF PARTIALLY TRANSFERRING HEAT BY A DIAMOND LAYER

摘要

PURPOSE: Heat conduction for chip stacks and 3-d circuits is provided to reduce manufacturing costs by enhancing thermal conductance of a semiconductor assembly.;CONSTITUTION: A part of a semiconductor layer is removed in order to form an opening extended from a front side of a semiconductor layer(16) to a back side of the semiconductor layer. A diamond layer(22) is formed including a first exposed surface on the front side of the semiconductor layer and a second exposed surface on the back side of the semiconductor layer. The semiconductor layer is etched in order to expose the diamond layer formed on the back side of the semiconductor layer. The diamond layer extended through the opening is extended by using the diamond layer formed on the back side of the semiconductor layer as crystallization nuclei.;COPYRIGHT KIPO 2012