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SPUTTERING APPARATUS CAPABLE OF PREVENTING DAMAGE OF A SUBSTRATE IN A SPUTTERING PROCESS
SPUTTERING APPARATUS CAPABLE OF PREVENTING DAMAGE OF A SUBSTRATE IN A SPUTTERING PROCESS
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机译:能够防止衬底在溅射过程中损坏的溅射装置
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摘要
PURPOSE: A sputtering apparatus is provided to prevent ultraviolet rays generating in plasma discharge around a target from being irradiated to a substrate because an ultraviolet ray shield is formed between the target and a susceptor placed on the substrate at a predetermined height.;CONSTITUTION: A sputtering apparatus comprises a chamber(100), a susceptor(200), a target(400), an ionizer(600), a neutralization and energy controller(700), and an ultraviolet ray shield(800). The susceptor supports a substrate in the chamber. The target is located in the side surface of the susceptor and is composed of deposition substances depositing on the substrate. The ionizer ionizes neutral particles consisting of target substances. The neutralization and energy controller controls energy while neutralizing the particles passing through the ionizer. The ultraviolet ray shield prevents ultraviolet rays generating in plasma discharge from being irradiated on the substrate.;COPYRIGHT KIPO 2012
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