METHOD FOR MANUFACTURING SOLDER PARTICLES WITH DIAMETER OF SUB-MICROMETERS OR SEVERAL MICROMETERS WITHOUT INCREASING OXIDE FILMS OF THE SOLDER PARTICLES

摘要

PURPOSE: A method for manufacturing solder particles with diameter of sub-micrometers or several micrometers is provided to obtain a small particle size without increase of an oxide film.;CONSTITUTION: A method for manufacturing solder particles with diameter of sub-micrometers or several micrometers comprises the steps of: mixing solder particles(4) having a diameter of 10-1000um with single polymer resin, heating the mixture at a temperature higher than the melting point of the solder particles, applying ultrasonic waves to the mixed solution to reduce the diameter of the solder particles below 0.1-10 um, and cooling the solder particles at the room temperature without exposure to the atmosphere.;COPYRIGHT KIPO 2013