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CHIP SCALE PACKAGE ASSEMBLY BY A RECONFIGURATION PANEL PROCESSING FORMAT WHICH INCREASES UTILIZATION EFFICIENCY OF A SUBSTRATE PANEL
CHIP SCALE PACKAGE ASSEMBLY BY A RECONFIGURATION PANEL PROCESSING FORMAT WHICH INCREASES UTILIZATION EFFICIENCY OF A SUBSTRATE PANEL
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机译:通过重新配置面板处理格式的芯片包装程序,可提高基板的利用率
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摘要
PURPOSE: A chip scale package assembly by a reconfiguration panel processing format is provided to economically and effectively put together integrated circuits such as ball grid array packages.;CONSTITUTION: A substrate panel which includes substrates having routing is formed(102). The substrate panel is singulated for dividing a plurality of substrates. A sub set of the divided substrates is attached to the surface of a carrier. One or more dies are mounted on the substrates of the carrier. The dies and the substrates on the carrier are encapsulated to a molding compound. The carrier is detached from the encapsulated dies and substrates.;COPYRIGHT KIPO 2013;[Reference numerals] (102) A substrate panel which includes substrates having routing is formed; (104) The substrate panel is singulated for dividing a plurality of substrates.
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