METHOD FOR CLEANING A THIN FILM FORMING APPARATUS CAPABLE OF ELIMINATING A REACTION PRODUCT ATTACHED WITHIN A HEAT TREATMENT APPARATUS, A THIN FILM FORMING METHOD, AND A THIN FILM FORMING APPARATUS

摘要

PURPOSE: A method for cleaning a thin film forming apparatus, a thin film forming method, and a thin film forming apparatus are provided to increase an etching rate of an attachment attached within the apparatus by supplying fluorine gas and hydrogen fluoride gas within a heated reaction tube.;CONSTITUTION: A reaction tube(2) forms a reaction chamber. A top portion(3) formed in a cone shape is installed on a top end portion of the reaction tube. An exhaust pipe(4) for exhausting gas within the reaction tube is installed in the center of the top portion. A spinning table(10) loads a wafer boat(11) which receives a wafer(W). A rotary support(12) is connected to a rotating mechanism(13) passing through the center of a heater(8).;COPYRIGHT KIPO 2013;[Reference numerals] (100) Control unit