LEAD FRAME FOR IMPROVING AN OPERATION RATE FOR PROCESS, A SEMICONDUCTOR PACKAGE, AND A FABRICATING METHOD THEREOF USING THE SAME

摘要

PURPOSE: A lead frame, a semiconductor package, and a fabricating method thereof using the same are provided to improve lamination quality by forming surface roughness on a lead frame raw material layer.;CONSTITUTION: Surface roughness is formed on a lead frame raw material layer(110). A first thin film plating layer(130) is formed on a part of the lead frame raw material layer. The surface roughness is formed to be in a range of 250 to 450 nanometers. A second thin film plating layer(150) has a thickness of 0.005 to 0.150 micrometers. The second thin film plating layer is formed on patterns of a wire bonding part.;COPYRIGHT KIPO 2013