Thermally Advanced Metallized Ceramic Substrate for Semiconductor Power Module and Method for Manufacturing thereof

摘要

The metallizing the thermal properties of ceramic substrates for improved power semiconductor module and its manufacturing method are disclosed. Original plate for a printed circuit board of the power semiconductor ceramic modules (Metallized Ceramic Substrate) of the present invention by a thick film of metal is a relatively large thermal expansion coefficient between the conductive layer of the substrate and vacuum depositing a copper (Cu) of the ceramic material to the magnetron sputtering By forming, to compensate for the difference in thermal expansion coefficient between the substrate and the copper thick-film. Accordingly, the original plate of the ceramic printed circuit board (Metallized Ceramic Substrate) will absorb the heat shock at the same time and effectively release the heat generated by the mounted Sikkim electrical or electronic device on the upper surface, thermal expansion coefficient of the ceramic material and copper of the impact thermal destruction caused by the difference (Crack) The phenomenon is significantly reduced. ; ceramic printed circuit board, Metallized Ceramic Substrate, thermal expansion coefficient, magnetron sputtering