首页> 外国专利> POLYMER RESIN-COPPER BONDED COMPONENT HAVING IMPROVED ADHESION AND TENSILE STRENGTH BY A NICKEL OXIDE LAYER FORMED ON A COPPER, AND A MANUFACTURING METHOD THEREOF

POLYMER RESIN-COPPER BONDED COMPONENT HAVING IMPROVED ADHESION AND TENSILE STRENGTH BY A NICKEL OXIDE LAYER FORMED ON A COPPER, AND A MANUFACTURING METHOD THEREOF

机译:通过在铜上形成的氧化镍层提高粘合性和拉伸强度的聚合物-树脂-铜键合组件及其制造方法

摘要

PURPOSE: A polymer resin-copper bonded component is provided to improve adhesion between metal and resin, and tensile strength, and to maintain tensile strength after thermal shock.;CONSTITUTION: A polymer resin-copper bonded component comprises copper, nickel formed on the copper, and a polymer resin combined on the nickel after triazine thiol group treatment. From the polymer resin-copper component, Ni and Cu components are detected by secondary ion mass spectroscopy(SIMS) of the polymer resin-copper bonded component. The intensity ratio of O/Ni, CN/Ni and S/Ni is 1.00 ×10-3~5.00×10-3 at the depth of 13-25 um.;COPYRIGHT KIPO 2012
机译:目的:提供聚合物树脂-铜键合的组件,以提高金属和树脂之间的粘合力,并提高抗张强度,并保持热冲击后的抗张强度。;组成:聚合物树脂-铜键合的组件包含铜,在铜上形成的镍,和在三嗪硫醇基团处理后在镍上结合的聚合物树脂。通过聚合物树脂-铜键合组分的二次离子质谱法(SIMS)从聚合物树脂-铜组分中检测Ni和Cu组分。 O / Ni,CN / Ni和S / Ni的强度比为1.00×10-3〜5.00×10-3在13-25 um的深度处; COPYRIGHT KIPO 2012

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