Colloidal Silica Based Chemical Mechanical Polishing Slurry

摘要

Li, Na, K, Rb, Cs, Fr, and has an alkali metal of a combination thereof, in the total alkali concentration of about 300ppb, however, the concentration of Na is, when there 200ppb or less, ultra-high purity for chemical mechanical polishing the chemical mechanical polishing composition comprising a sol-gel process with a large number of medium to suspended colloidal silica particles and the particles are provided. In addition, there is provided a chemical mechanical polishing method comprising contacting the composition according to the invention and the substrate. The contacting step is performed for a temperature and for a time sufficient to flatten the substrate. ; CMP, chemical-mechanical polishing composition, an alkali metal, colloidal particles