METHOD FOR MANUFACTURING A FLIP-CHIP SMALL OUTLINE PACKAGE CAPABLE OF REDUCING FAILURE RATE BY SIMPLIFYING MANUFACTURING PROCESS

摘要

PURPOSE: A method for manufacturing a flip- chip small outline package is provided to simply form a solder bump of high reliability by omitting a coining process of expensive costs and to reduce manufacturing costs.;CONSTITUTION: A solder resist(20) is spread on the surface of a substrate in which a copper circuit(10) is formed. The copper circuit comprises a copper pad. A solder resist opening part is formed by selectively etching the solder resist. A solder paste(40) is inserted into the solder resist opening part and a solder is formed. The solder is loaded on a plate(110) in order to be touched to the surface. A flux exhaustion process and a process flattering the solder surface are executed at the same time without an additional follow up coining process.;COPYRIGHT KIPO 2012