STACKED BODY FOR COF SUBSTRATE, METHOD FOR MANUFACTURING SUCH STACKED BODY FOR COF SUBSTRATE, AND COF FILM CARRIER TAPE FORMED BY USING SUCH STACKED BODY FOR COF SUBSTRATE

摘要

transmitted through the insulating layer and a wiring capable of recognition of the driver IC chip at the same time, the conductor and the insulating layer high adhesion, excellent in electromigration sex, for example, provides a fine processing as a laminate and a method of manufacturing the following 30 pitch. ; insulation on one side of the conductor made of a conductive metal foil The laminate for the COF substrate made of a resin insulating layer is formed, the thickness of the conductor is 1 ~ 8 , the surface roughness (Rz) of the surface in contact with the insulating layer of the conductor, yet below 1.0 , in contact with the insulating layer of the conductor and do not have the surface roughness (Rz) is not more than 1.0 COF substrate for the laminate of the surface, while having also at least one 10 thickness, the surface roughness (Rz) is isolated on the surface of the conductive metal foil layer on one side or less 1.0 are formed, the surface of the conductive foil that is not in contact with the insulating layer to the chemical polishing, while the thickness of the conductive metal foil as a 1 ~ 8 , and the surface roughness (Rz) below 1.0 COF substrate to form a conductor for a method for manufacturing a layered product.