A catalyst precursor resin composition for electromagnetic interference shielding, and a method for preparing a metal pattern for electromagnetic interference shielding by using the composition are provided to allow micropattern to be formed, to reduce the loss of a catalyst in case of wet process such as electroless plating and to improve the adhesion and deposition of a metal pattern. A catalyst precursor resin composition for electromagnetic interference shielding comprises a copolymer resin comprising a monomer containing a carboxyl group and a maleimide monomer having the nitrogen substituted with oil-soluble functional group; a catalyst which is one selected from a palladium (Pd) particle, a silver (Ag) particle and a silver ion fluoride organic complex; a multifunctional monomer containing an ethylenically unsaturated bond; a photoinitiator; and an organic solvent.
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