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HIGH INTEGRATION COMPUTER SYSTEM WITH HIGH-PERFORMANCE MOTHERBOARD SHARING STRUCTURE
HIGH INTEGRATION COMPUTER SYSTEM WITH HIGH-PERFORMANCE MOTHERBOARD SHARING STRUCTURE
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机译:具有高性能主板共享结构的高集成度计算机系统
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摘要
The present invention relates to a highly integrated computer system of a common structure of a high-efficiency CPU card, and more particularly, includes an apparatus body, at least one expansion card module, a plurality of CPU cards, and at least one high-efficiency CPU card. A main back panel is installed in the device body, a main control electric circuit and a plurality of main back panel insertion connection grooves are installed in the main back panel, and the at least one expansion card module is inserted into the device body. The expansion card module includes a sub back panel, and the sub back panel is provided with a sub control electric circuit and a plurality of second sub back panel inserting recesses, and one end of the sub back panel inserts a first sub back panel. A connection groove is installed, and the first sub back panel insertion connection groove is located in the main back panel insertion connection groove. Correspondingly inserted and installed, the first sub back panel insertion connection groove, the sub control electric circuit and the plurality of second sub back panel insertion connection grooves are electrically connected to each other, and the plurality of CPU cards are connected to the second sub And a CPU card inserted into and connected to the back panel insertion connection groove, wherein a microprocessor is installed on the CPU card, and two or more microprocessors are installed on the at least one high-efficiency CPU card. Efficacy The CPU card relates to a highly integrated computer system configured to be inserted into two or more second sub back panel inserting groove positions, and this type of computer system is produced because it can have a powerful modular assembly function. It will be able to achieve the effect of greatly improving the benefits and product competitiveness.
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