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Rib structures in card to backplane optical high speed interconnect couplers and related sensitivity for computer motherboards

机译:卡到背板​​的光学高速互连耦合器中的肋结构以及计算机主板的相关灵敏度

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The single-mode/multi-mode rib structures for high-speed optical card-to-backplane interconnects in computer motherboards are presented. In the system, we used evanescent coupling with the required known coupled power for the horizontal waveguide coupler and almost full power coupling in the vertical waveguide coupler. The rib structure parameters are varied to obtain single mode or multimode waveguides, where the rib width/height ratio and the slab height effectively control the single mode or multimode structures. For the required coupled power, the single-mode rib-waveguides require lower values of coupling length compared to that of the multimode rib- waveguides. The larger core area of SM rib structure to couple power easily from the source to the waveguide is shown. The modal dispersion effect arising in multimode waveguides is studied to improve the bit rate performance. The fabrication to prepare the polymeric optical waveguide with the conventional process by patterning with mask is shown. The experimental repeated results show that the output power variation limits within 10%. The simulated BeamPROP results for the light coupling are compared with the theoretical and experimental results.
机译:提出了用于计算机母板中高速光卡到背板互连的单模/多模肋结构。在该系统中,我们将van逝波耦合与水平波导耦合器所需的已知耦合功率和垂直波导耦合器中的几乎全功率耦合一起使用。改变肋结构参数以获得单模或多模波导,其中肋的宽度/高度比和平板高度有效地控制了单模或多模结构。对于所需的耦合功率,与多模肋状波导相比,单模肋状波导所需的耦合长度值更低。示出了SM肋结构的较大的芯区域,以容易地将功率从源耦合到波导。为了提高比特率性能,研究了在多模波导中产生的模态色散效应。示出了通过用掩模构图以常规方法制备聚合物光波导的制造方法。重复的实验结果表明,输出功率变化限制在10%以内。将模拟的BeamPROP光耦合结果与理论和实验结果进行比较。

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